Feature
● High Filling: High degree of spheroidization rate, controllable particle size distribution, achieve high density filling for silicone and epoxy resin, to get the mixture with low viscosity and high mobility;
● High Thermal Conductivity: Because of its almost perfect ball structure, the filler used in the raw materials can achieve multi-directional heat transmission. The whole mixed system is in state of good dispersion, so final products have excellent thermal conductivity and physical property;
● Low Abrasion: Compared with irregular powder, the application of spherical filler can reduce the abrasion of the mixer, molding machines and other equipment, then prolong working life of relevant equipment
Application
●Thermal Interface Materials: thermal silica pad, thermal grease, thermally conductive potting glue, phase change materials
●Thermally Conductive Engineering Plastics: LED lamp cover, switch shell,electronic products shell, electrical products heat dissipation parts;
●Al-based Copper Clad Laminate: high-power LED circuit substrate, power circuit boards, etc;
●Alumina Ceramic Filters;
●Thermal Spray Coating.
