Feature
● High sintering activity ;
● High crystallinity, regular morphology ;
● Sharp particle size distribution ;
● Low content of C and O
Application
● Thermally conductive materials filler;
● A raw material for high thermal conductivity AlN ceramic substrates;
● The core parts of high thermal conductivity semiconductors and electronic products;
● EMC, TIM filler, FCCL thermal conductive dielectric layer filler;
● Heat dissipation and packaging materials for a new generation of large-scale integrated circuit, semiconductor module circuits and high-power devices;
● Additives for composite materials such as plastic substrates and evaporation boats, and fillers for high-temperature structural materials such as crucibles
