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Boron Nitride(Flake)
Two modified flake boron nitride powder solves the problem of poor compatibility between flake boron nitride and organic systems. The HBN series is suitable for organosilicon systems, and RBN series is suitable for epoxy system.

Feature

● High thermal conductivity ;
● Excellent compatibility with organic systems;
● Stable physical and chemical properties, low dielectric;
● Low Mohs hardness (<2), conducive to the protection of precision machine;
● We can provide professional treatment technology for our clients based on their requirements



Application

● Thermal interlace materials: thermal pads, thermal silicone grease, thermally conductive paste, thermally conductive phase change materials.
● Thermal conductivity alumina-based CCL, printed circuit board prepreg.
● Thermally conductive engineering plastics.




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Particle size-HBN
24-05-10
Particle size-RBN
24-05-10
SEM-HBN
24-05-10
SEM-RBN
24-05-10