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Spherical Boron Nitride
Spherical boron nitride has thermal isotropic properties, which overcomes the disadvantages of the thermal anisotropy of flake boron nitride. At the same filling amount, the thermal conductivity of spherical boron nitride is more than 3 times that of flake boron nitride. The HRBNL series have lower density than HRBN series, and have high viscosity in the system, high thermal conductivity in case of the same filling amount. But it is not easy to achieve high filling, it is recommended to use with HRBN series.



Feature

● High thermal conductivity ;
● Low S.S.A.;
● High filling ability (for low shear machining applications)
● Thermal isotropic;
● The particle size is uniform, and the distribution is very narrow, conducive to achieve a stable match with other fillers in the application.


Application

● Electronic packaging;
● High frequency power devices;
● Solid state LED lighting;
● Thermal interface materials: thermal pads, thermal silicone grease, thermally conductive paste, thermally conductive phase change materials;
● Thermal conductivity alumina-based CCL, printed circuit board prepreg;
● Thermally conductive engineering plastics.


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Advantage
24-05-13
Particle size-HRBN
24-05-13
Particle size-HRBNL
24-05-13
SEM-HRBN
24-05-13
SEM-HRBNL
24-05-13